High Frequency Surface Mount Technology (SMT) packages

Cost effective solutions for Hermetic and Non-hermetic packages Custom impedance matching for MMICs

Technology enabling smaller RF modules

● High Frequency Multilayer RF Boards

• RF Impedance matched material (i.e. RO4003)
• Using blind, buried and thru vias
• Our proprietary grounding and shielding designs

● Heat spreading material integration

● HTCC and Thick/Thin film ceramic materials

● LTCC

• Buried components
• Cavities for MMIC/die and passives